Integrated antenna and EMI shielding support member for portable communications terminals

ABSTRACT

According to various aspects, exemplary embodiments are provided of portable communications terminals and assemblies thereof. In one exemplary embodiment, a portable communications terminal includes a support member. An antenna is supported by the support member. Electromagnetic interference (EMI) shielding structure is also supported by the support member. A printed circuit board includes one or more electronic components mounted thereon. The EMI shielding structure is operable for providing EMI shielding for one or more electronic components that are disposed within the interior defined by the EMI shielding structure and the printed circuit board.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part of International ApplicationNo. PCT/US2009/040931 filed Apr. 17, 2009 (published as WO 2009/129447on Oct. 22, 2009), which, in turn, claimed the benefit of U.S.Provisional Application No. 61/045,939 filed Apr. 17, 2008. The entiredisclosure of each of the above applications is incorporated herein byreference in its entirety.

FIELD

The present disclosure generally relates to portable communicationsterminals, such as cellular phones. More specifically, the presentdisclosure relates to portable communications terminals having aninternal frame or middle deck that supports both the antenna forreceiving and transmitting signals and the shield that provideselectromagnetic interference (EMI) shielding for board-mountedelectronic components of a printed circuit board (PCB).

BACKGROUND

This section provides background information related to the presentdisclosure which is not necessarily prior art.

Portable wireless communications terminals (e.g., cellular phones withbuilt-in digital cameras, etc.) have become increasingly popular. Withincreasing popularity, the number of users and their particularpreferences and tastes in regard to functionality and operation of thedevices have also increased, such as different user preferences as tohow the device is opened and closed. In response to user demand,different types of portable terminals have been developed, such as bartype, flip type, flip-up type, and folder type.

In addition, slider type terminals have also been introduced. Slidertype terminals can be equipped with an LCD module display device havinga similar size as the LCD module display device commonly provided withthe folder type terminals. Slider mechanisms may help contribute to sizereduction or miniaturization of portable terminals into which they areincorporated. Conventional slider type terminals include a sub-body orcover that may be slidably opened and closed on a main body.

As with other electronic equipment, the electronic components ofcellular phone's PCB generate electromagnetic signals that may radiateto and interfere with other electronic components internal or externalto the cellular phone. This electromagnetic interference (EMI) can causedegradation of signals, thereby rendering the cellular phone or adjacentelectronic equipment inefficient. To reduce the adverse effects of EMI,electrically conducting material is interposed between the electroniccircuitry for absorbing and/or reflecting EMI energy. This shielding maytake the form of a complete enclosure (e.g., a single-piece board levelshielding (BLS) can or enclosure, two-piece BLS shield, etc.) which maybe placed around the electronic components of the PCB that generateelectromagnetic signals and/or that may be susceptible toelectromagnetic signals. For example, electronic circuits or componentsof a printed circuit board of a slider-type cellular phone are oftenenclosed within the top cover or lid and sidewalls of a BLS can in orderto localize EMI within its source and/or to insulate the PCB electroniccircuits or components from external EMI sources. Typically, the BLS canis a separately manufactured single-piece component that is separatelyinstalled between the PCB and the slide assembly. For example, the BLScan is typically mounted (e.g., soldered, etc.) to the PCB before thePCB is attached to the slider mechanism. After installation of the BLScan, the PCB may then be attached to the slider mechanism.

As used herein, the term electromagnetic interference (EMI) should beconsidered to generally include and refer to both electromagneticinterference (EMI) and radio frequency interference (RFI) emissions. Theterm “electromagnetic” should be considered to generally include andrefer to both electromagnetic and radio frequency from external sourcesand internal sources. Accordingly, the term shielding (as used herein)generally includes and refers to both EMI shielding and RFI shielding,for example, to prevent (or at least reduce) ingress and egress of EMIand RFI relative to a shielding device in which electronic equipment isdisposed.

SUMMARY

This section provides a general summary of the disclosure, and is not acomprehensive disclosure of its full scope or all of its features.

According to various aspects, exemplary embodiments are provided ofportable communications terminals and assemblies thereof. In anexemplary embodiment, a portable communications terminal includes asupport member. An antenna is supported by the support member.Electromagnetic interference (EMI) shielding structure is also supportedby the support member. A printed circuit board includes one or moreelectronic components mounted thereon. The EMI shielding structure isoperable for providing EMI shielding for one or more electroniccomponents that are disposed within the interior defined by the EMIshielding structure and the printed circuit board.

Other exemplary embodiments provide assemblies for portablecommunications terminals, that have printed circuit boards with one ormore electronic components mounted thereon. In an exemplary embodiment,an assembly generally includes a support member. An antenna is supportedby the support member. EMI shielding structure is also supported by thesupport member. The EMI shielding structure is operable for providingEMI shielding for one or more electronic components disposed within theinterior defined by the EMI shielding structure and the printed circuitboard.

Other exemplary embodiments include methods relating to portablecommunications terminals. In an exemplary embodiment, a method generallyincludes attaching EMI shielding structure directly to a support memberfor a portable communications terminal. The support member also supportsan antenna for receiving and transmitting signals. The EMI shieldingstructure is operable for providing EMI shielding for one or moreelectronic components of a printed circuit board of the portablecommunications terminal. In another exemplary embodiment, a methodgenerally includes positioning a support member relative to a printedcircuit board of the portable communications terminal such that EMIshielding structure supported by the support member provides EMIshielding for one or more electronic components of the printed circuitboard. In addition to supporting the EMI shielding structure, thesupport member also supports an antenna for receiving and transmittingsignals.

Further areas of applicability will become apparent from the descriptionprovided herein. It should be understood that the description andspecific examples are intended for purposes of illustration only and arenot intended to limit the scope of the present disclosure.

DRAWINGS

The drawings described herein are for illustrative purposes only ofselected embodiments and not all possible implementations, and are notintended to limit the scope of the present disclosure.

FIG. 1 is an exploded perspective view showing a portable communicationsterminal having an internal support member to which is attached anantenna and an EMI shield, according to an exemplary embodiment of thepresent disclosure;

FIG. 2 is a perspective view showing the internal support member withthe antenna and EMI shield attached thereto, and the back side of theprinted circuit board (shown in FIG. 1) having electronic componentsthereon, wherein the EMI shield is configured to define EMI shieldingcompartments that correspond to the layout of the PCB electroniccomponents;

FIG. 3 is a simplified schematic of the components of the portablecommunications terminal shown in FIG. 1; and

FIG. 4 is an exploded perspective view showing a portable communicationsterminal having an internal support member to which is attached anantenna and an EMI shield, according to another exemplary embodiment ofthe present disclosure.

Corresponding reference numerals indicate corresponding parts throughoutthe several views of the drawings.

DETAILED DESCRIPTION

The foregoing description of the embodiments has been provided forpurposes of illustration and description. It is not intended to beexhaustive or to limit the invention. Individual elements or features ofa particular embodiment are generally not limited to that particularembodiment, but, where applicable, are interchangeable and can be usedin a selected embodiment, even if not specifically shown or described.The same may also be varied in many ways. Such variations are not to beregarded as a departure from the invention, and all such modificationsare intended to be included within the scope of the invention.

According to various aspects, exemplary embodiments are provided ofportable communications terminals and assemblies thereof. In anexemplary embodiment, a portable communications terminal includes asupport member. An antenna is supported by the support member. EMIshielding structure is also supported by the support member. A printedcircuit board includes one or more electronic components mountedthereon. The EMI shielding structure is operable for providing EMIshielding for one or more electronic components that are disposed withinthe interior defined by the EMI shielding structure and the printedcircuit board.

Other exemplary embodiments provide assemblies for portablecommunications terminals, that have printed circuit boards with one ormore electronic components mounted thereon. In an exemplary embodiment,an assembly generally includes a support member. An antenna is supportedby the support member. EMI shielding structure is also supported by thesupport member. The EMI shielding structure is operable for providingEMI shielding for one or more electronic components that are disposedwithin the interior defined by the EMI shielding structure and theprinted circuit board.

Other exemplary embodiments include methods relating to portablecommunications terminals. In an exemplary embodiment, a method generallyincludes attaching EMI shielding structure directly to a support memberfor a portable communications terminal. The support member also supportsan antenna for receiving and transmitting signals. The EMI shieldingstructure is operable for providing EMI shielding for one or moreelectronic components of a printed circuit board of the portablecommunications terminal.

In another exemplary embodiment, a method generally includes positioninga support member relative to a printed circuit board of the portablecommunications terminal such that EMI shielding structure supported bythe support member provides EMI shielding for one or more electroniccomponents of the printed circuit board. In addition to supporting theEMI shielding structure, the support member also supports an antenna forreceiving and transmitting signals.

In various embodiments, the support member is a middle deck to which ismounted the antenna and the EMI shielding structure without any directphysical attachment (e.g., mechanical fasteners, soldering, etching on aPCB, etc.) of the antenna or EMI shielding structure to the printedcircuit board. For example, some embodiments do not include anymechanical fasteners or soldering of the EMI shielding structure and/orantenna directly to the PCB.

As recognized by the inventors hereof, total costs and size may bereduced for some portable communications terminals (e.g., cellularphones, etc.) by attaching EMI shielding structure directly to the samemiddle deck, frame, or support member to which is attached the antenna,instead of mounting the EMI shielding structure directly to the PCB. Forexample, some exemplary embodiments attach (e.g., weld, etc.) a metalpiece (e.g., EMI shielding can or enclosure, etc.) directly to themiddle deck, frame, or support member to which is attached a PIFA patchantenna that has etched copper film. By supporting both the antenna andEMI shielding structure from the middle deck, frame, or support member,the inventors hereof have recognized that the overall height of theportable communications terminal may be reduced (e.g., up to about 0.5millimeter height reduction, etc.) because there is no longer the needto provide extra room or tolerance between the EMI shield soldered tothe PCB and the middle deck, frame, or support member, as the EMI shieldis not soldered to the PCB. Because the EMI shield is not soldered tothe PCB but is instead attached to the middle deck, frame, or supportmember in embodiments disclosed herein, access to the electroniccomponents on the PCB can be accomplished by detaching and removing thePCB from the middle deck, frame, or support member, thus providingaccess, for example, to repair, replace, rework, test, etc. theelectronic components on the PCB.

In addition, the inventors have also recognized that there is less radiofrequency (RF) variation as the tolerance stack between the antenna andthe EMI shield is reduced. Plus, the antenna can be tested when theantenna and the EMI shield are both attached to the middle deck, frame,or support member before they are shipped to the original equipmentmanufacturer (OEM), etc. of the portable communications terminal.Supporting both the antenna and EMI shielding structure from the samemiddle deck, frame, or support member may also provide a more stablesystem.

In some embodiments, the EMI shield is attached or mounted to the middledeck, frame, or support by a snap-fit, friction fit, or interference fitconnection. This connection may be configured so as to be strong enoughto help hold the EMI shield in place relative to the middle deck, frame,or support when the middle deck, frame, or support is being shipped ortransported with the EMI shield connected thereto, independent of orwithout the other components of the portable communications terminal.Alternative embodiments may include other mounting methods, such asmechanical fasteners.

With reference now to the figures, FIGS. 1 and 3 illustrate an exemplaryportable communications terminal 100. As shown, the portablecommunications terminal 100 includes front and back covers or housingportions 104 and 108. An internal frame or user interface support 112 isdisposed behind the front cover 104. The user interface support 112 maybe used to support one or more user interface components, such as akeypad 116, a display device 120 (e.g., LCD display, etc.), etc. Theuser interface support 112 and front cover 104 may include windows oropenings through which the display device 120 is externally visible. Thekeypad 116 and display device 120 are electrically connected to a PCB124 having electronic components thereon 128 (the electronic components128 are shown in FIG. 2). The keypad 116 and display device 120 allow auser to interface with the portable communications terminal 100 forcarrying out various functions of the portable communications terminal100.

Also shown in FIG. 3 is a battery 132 and an internal frame, middledeck, or support member 136. The support member 136 may be formed of asuitable material, such as plastic, a composite material, anelectrically non-conductive or dielectric material, etc. As shown inFIGS. 1, 2, and 3, the support member 136 may be used to support anantenna 140 (e.g., PIFA patch antenna having etched copper film, etc.)and EMI shielding structure 144 (the details of which are shown in FIG.2), among other components.

In the illustrated embodiment, the antenna 140 and EMI shieldingstructure 144 are attached to opposite sides of the support member 136.By way of example, the antenna 140 may be adhesively attached to thesupport member 136. Also by way of example, the EMI shielding structure144 may be attached to the support member 136 by a snap-fit, frictionfit, or interference fit connection. For example, the EMI shieldingstructure 144 may include resilient spring fingers, tabs, or otherresilient members for forming the snap-fit, friction fit or interferencefit connection. The connection may be configured so as to besufficiently strong enough to help hold the EMI shielding structure 144in place relative to the support member 136, for example, when thesupport member 136 is being shipped or transported with the antenna 140and EMI shielding structure 144 connected thereto, independent of andwithout the other components of the portable communications terminal100. Alternative embodiments may include other means or methods forattaching the antenna 140 and/or EMI shielding structure 144 to thesupport member 136, such as mechanical fasteners, adhesives, soldering,welding, etc.

In the illustrated embodiment shown in FIG. 2, the EMI shieldingstructure 144 includes walls extending from a lid portion. The walls areconfigured (e.g., sized, located, shaped, etc.) to define plurality ofindividual EMI shielding compartments 148A, 148B, 148C that correspondto the layout of the PCB electronic components 128. Accordingly, the PCBelectronic components 128 may thus be positioned in differentcompartments defined by the EMI shielding structure 144 such that thePCB electronic components 128 are provided with EMI shielding by virtueof the EMI shielding compartments 148 inhibiting the ingress and/oregress of EMI into and/or out of each EMI shielding compartment 148.

The EMI shielding structure 144 is illustrated as being monolithicallyformed as a single component structure. For example, the EMI shieldingstructure 144 may be formed by drawing (e.g., over a die, etc.),bending, stamping, folding, etc. Alternative embodiments may include aplurality of separate pieces that are separately attached to the supportmember 136.

The EMI shielding structure 144 may be formed from various materials,such as electrically-conductive materials like cold rolled steel,nickel-silver alloys, copper-nickel alloys, stainless steel, tin-platedcold rolled steel, tin-plated copper alloys, carbon steel, brass,copper, aluminum, copper-beryllium alloys, phosphor bronze, steel,alloys thereof, or any other suitable electrically-conductive and/ormagnetic materials. In addition, the EMI shielding structure 144 may beformed from a plastic material coated with electrically-conductivematerial.

With continued reference to FIG. 2, the EMI shielding structure 144includes resilient spring fingers 152. The spring fingers 152 may beconfigured for contacting electrically-conductive surfaces 156 (asrepresented by the speckled portions 156) (e.g., ground traces, etc.) ofthe PCB 124, to provide an electrical grounding pathway or connectionbetween the EMI shielding structure 144 and the PCB 124. A wide range ofmaterials may be used for the EMI shielding structure 144 and fingers152, preferably electrically-conductive materials having sufficientresiliency or springiness for permitting the spring fingers 152 to be atleast partially deflected in the final installed position or assembly.For example, this resiliency may allow the spring fingers 152 to deflector flex, and then to respond with a sufficient restorative force forbiasing the spring fingers 152 against the electrically-conductivesurfaces 156 of the PCB 124. This biasing force may help the springfingers 152 maintain good electrical contact with the PCB 124. In someexemplary embodiments, EMI shielding structures may include formedfinger gaskets (e.g., formed by bending, stamping, folding, etc.) madefrom beryllium copper alloys or other suitable electrically-conductivematerials.

In addition, a compressive clamping force may be generated when thevarious components of the portable communications terminal 100 areassembled. For example, assembly (e.g., mechanical fastening, etc.) ofthe PCB 124 to the support member 136 or other component(s) may generatea compressive clamping force such that the EMI shielding structure 144is compressively sandwiched between the PCB 124 and the support member136. This compressive clamping force may compress the spring fingers 152against electrically-conductive surfaces 156 (e.g., ground traces, etc.)on the PCB 124, to help establish good electrical conductivitytherebetween that is sufficient for EMI shielding performance.

In the illustrated embodiment of FIG. 2, the EMI shielding structure 144includes a lid portion and plurality of walls extending from the lidportion. In other embodiments, the EMI shielding structure 144 mayinclude the walls only without any lid portion. In these otherembodiments, a portion of the support member 136 that resides within aperimeter defined by the EMI shielding structure 144 may be configured(e.g., formed out of a suitable shielding material) to be operable as anEMI shielding lid. In which case, the EMI shielding structure 144 andthe corresponding portion of the support member 136 are operable forcooperatively providing EMI shielding for the electronic componentsdisposed within the interior cooperatively defined by the EMI shieldingstructure 144 and the corresponding portion of the support member 136,and the printed circuit board 124.

FIG. 4 illustrates a portable communications terminal 200 according toanother exemplary embodiment. As shown in FIG. 4, the portablecommunications terminal 200 includes front and back covers or housingportions 204 and 208. An internal frame or user interface support 212 isdisposed behind the front cover 204. The user interface support 212 maybe used to support one or more user interface components, such as akeypad 216, a display device 220 (e.g., LCD display, etc.), etc. Theuser interface support 212 and front cover 204 may include windows oropenings through which the display device 220 is externally visible. Thekeypad 216 and display device 220 are electrically connected to a PCB224 having electronic components thereon 228. The keypad 216 and displaydevice 220 allow a user to interface with the portable communicationsterminal 200 for carrying out various functions of the portablecommunications terminal 200.

Also shown in FIG. 4 is an internal frame, middle deck, or supportmember 236, which may be formed of a suitable material, such as plastic,a composite material, an electrically non-conductive or dielectricmaterial, etc. The support member 236 may be used to support an antenna240 (e.g., stub antenna, PIFA patch antenna having etched copper film,etc.) and EMI shielding structure 244, among other components.

By way of example, the antenna 240 may be mechanically fastened viathreaded connection to the support member 236. Also by way of example,the EMI shielding structure 244 may be attached to the support member236 by a snap-fit, friction fit, or interference fit connection. Forexample, the EMI shielding structure 244 may include resilient springfingers, tabs, or other resilient members for forming the snap-fit,friction fit or interference connection. The connection may beconfigured so as to be sufficiently strong enough to help hold the EMIshielding structure 244 in place relative to the support member 236, forexample, when the support member 236 is being shipped or transportedwith the antenna 240 and EMI shielding structure 244 connected thereto,independent of and without the other components of the portablecommunications terminal 200. Alternative embodiments may include othermeans or methods for attaching the antenna 240 and/or EMI shieldingstructure 244 to the support member 236, such as mechanical fasteners,adhesives, soldering, welding, etc.

The EMI shielding structure 244 may include walls configured (e.g.,sized, located, shaped, etc.) to define plurality of individual EMIshielding compartments (e.g., compartments 148A, 148B, 148C in FIG. 2,etc.) that correspond to the layout of the PCB electronic components228. Accordingly, the PCB electronic components 228 will thus bepositioned in different compartments defined by the EMI shieldingstructure 244 such that the PCB electronic components 228 are providedwith EMI shielding by virtue of the EMI shielding compartmentsinhibiting the ingress and/or egress of EMI into and/or out of each EMIshielding compartment.

The EMI shielding structure 244 may be monolithically formed as a singlecomponent structure. For example, the EMI shielding structure 244 may beformed by drawing (e.g., over a die, etc.), bending, stamping, folding,etc. Alternative embodiments may include a plurality of separate piecesthat are separately attached to the support member 236. The EMIshielding structure 244 may also include one or more spring fingers(e.g., spring fingers 152 shown in FIG. 2, etc.) in some embodiments.

The EMI shielding structure 244 may be formed from various materials,such as electrically-conductive materials like cold rolled steel,nickel-silver alloys, copper-nickel alloys, stainless steel, tin-platedcold rolled steel, tin-plated copper alloys, carbon steel, brass,copper, aluminum, copper-beryllium alloys, phosphor bronze, steel,alloys thereof, or any other suitable electrically-conductive and/ormagnetic materials. In addition, the EMI shielding structure 244 may beformed from a plastic material coated with electrically-conductivematerial.

FIGS. 1 through 4 illustrate exemplary embodiments of portablecommunications terminals in which aspects of the present disclosure maybe incorporated. Aspects of the present disclosure, however, should notbe limited solely to these particular devices. For example, aspects ofthe present disclosure may be incorporated into portable terminals, suchas portable communications terminals or devices like cellular phones,personal digital assistants (PDAs), other electronic devices, flip-typeportable communications terminals, sliding-type portable communicationsterminals, rotating-type portable communications terminals, portablecommunications terminals that are not configured to be opened andclosed, etc. within the scope of the present disclosure.

Spatially relative terms, such as “inner,” “outer,” “beneath”, “below”,“lower”, “above”, “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. Spatiallyrelative terms may be intended to encompass different orientations ofthe device in use or operation in addition to the orientation depictedin the figures. For example, if the device in the figures is turnedover, elements described as “below” or “beneath” other elements orfeatures would then be oriented “above” the other elements or features.Thus, the example term “below” can encompass both an orientation ofabove and below. The device may be otherwise oriented (rotated 90degrees or at other orientations) and the spatially relative descriptorsused herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularexample embodiments only and is not intended to be limiting. As usedherein, the singular forms “a”, “an” and “the” may be intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. The terms “comprises,” “comprising,” “including,” and“having,” are inclusive and therefore specify the presence of statedfeatures, integers, steps, operations, elements, and/or components, butdo not preclude the presence or addition of one or more other features,integers, steps, operations, elements, components, and/or groupsthereof. The method steps, processes, and operations described hereinare not to be construed as necessarily requiring their performance inthe particular order discussed or illustrated, unless specificallyidentified as an order of performance. It is also to be understood thatadditional or alternative steps may be employed.

When an element or layer is referred to as being “on”, “engaged to”,“connected to” or “coupled to” another element or layer, it may bedirectly on, engaged, connected or coupled to the other element orlayer, or intervening elements or layers may be present. In contrast,when an element is referred to as being “directly on,” “directly engagedto”, “directly connected to” or “directly coupled to” another element orlayer, there may be no intervening elements or layers present. Otherwords used to describe the relationship between elements should beinterpreted in a like fashion (e.g., “between” versus “directlybetween,” “adjacent” versus “directly adjacent,” etc.). As used herein,the term “and/or” includes any and all combinations of one or more ofthe associated listed items.

Although the terms first, second, third, etc. may be used herein todescribe various elements, components, regions, layers and/or sections,these elements, components, regions, layers and/or sections should notbe limited by these terms. These terms may be only used to distinguishone element, component, region, layer or section from another region,layer or section. Terms such as “first,” “second,” and other numericalterms when used herein do not imply a sequence or order unless clearlyindicated by the context. Thus, a first element, component, region,layer or section discussed below could be termed a second element,component, region, layer or section without departing from the teachingsof the example embodiments.

Example embodiments are provided so that this disclosure will bethorough, and will fully convey the scope to those who are skilled inthe art. Numerous specific details are set forth such as examples ofspecific components, devices, and methods, to provide a thoroughunderstanding of embodiments of the present disclosure. It will beapparent to those skilled in the art that specific details need not beemployed, that example embodiments may be embodied in many differentforms and that neither should be construed to limit the scope of thedisclosure. In some example embodiments, well-known processes,well-known device structures, and well-known technologies are notdescribed in detail.

The description of the disclosure is merely exemplary in nature and,thus, variations that do not depart from the gist of the disclosure areintended to be within the scope of the disclosure. Such variations arenot to be regarded as a departure from the spirit and scope of thedisclosure.

1. A portable communications terminal comprising: front and back housingportions; a printed circuit board having one or more electroniccomponents mounted thereon; a support member adjacent the printedcircuit board and between the front and back housing portions; anantenna attached to the support member; and electromagnetic interference(EMI) shielding structure attached to the support member; whereby theEMI shielding structure is operable for providing EMI shielding for oneor more of the electronic components that are disposed within theinterior defined by the EMI shielding structure and the printed circuitboard.
 2. The portable communications terminal of claim 1, wherein thesupport member is a middle deck.
 3. The portable communications terminalof claim 2, wherein: the antenna is mounted to the middle deck withoutany direct physical attachment of the antenna to the printed circuitboard; and the EMI shielding structure is mounted to the middle deckwithout any direct physical attachment of the EMI shielding structure tothe printed circuit board.
 4. The portable communications terminal ofclaim 1, wherein: the support member comprises an internal frame havingan opening configured for receiving therein the EMI shielding structure;and the antenna and EMI shielding structure are attached directly to thesupport member without any direct physical attachment to the printedcircuit board; and the EMI shielding structure and the support memberare configured to form a snap-fit, friction fit, or interference fitconnection therebetween.
 5. The portable communications terminal ofclaim 1, wherein: the support member includes generally oppositelyfacing first and second sides; the antenna is attached directly to thefirst side of the support member; and the EMI shielding structure isattached directly to the second side of the support member.
 6. Theportable communications terminal of claim 1, wherein: the antenna andEMI shielding structure are attached directly to the support member witha spaced distance separating the antenna from the EMI shieldingstructure; and the support member is dielectric; and the antennacomprises a PIFA patch antenna having etched copper film that isattached to the support member.
 7. The portable communications terminalof claim 1, wherein: the EMI shielding structure includes a lid portionand plurality of walls extending from the lid portion; and the EMIshielding structure defines two or more EMI shielding compartmentscorresponding to the layout of the electronic components of the printedcircuit board, such that the electronic components are positionable indifferent EMI shielding compartments; and the EMI shielding structurecomprises at least one resilient finger extending generally outwardlyfrom the EMI shielding structure towards the printed circuit board, forelectrically contacting at least one electrically conductive surface ofthe printed circuit board; and the EMI shielding structure ismonolithically formed as a single component structure; and the EMIshielding structure is compressively sandwiched between the printedcircuit board and the support member.
 8. The portable communicationsterminal of claim 1, wherein the EMI shielding structure includes one ormore spring fingers configured for contacting one or moreelectrically-conductive surfaces of the printed circuit board.
 9. Theportable communications terminal of claim 8, wherein the one or morespring fingers are formed from electrically-conductive material havingsufficient resiliency for permitting the one or more spring fingers tobe at least partially deflected and then to respond with a sufficientrestorative force for biasing the one or more spring fingers against theone or more electrically-conductive surfaces of the printed circuitboard, for maintaining good electrical contact with the one or moreelectrically-conductive surfaces of the printed circuit board.
 10. Theportable communications terminal of claim 1, further comprising: a userinterface support member disposed between the front and back housingportions; a keypad supported by the user interface support member; and adisplay device supported by the user interface support member.
 11. Anassembly for a portable communications terminal including front and backhousing portions and a printed circuit board having one or moreelectronic components mounted thereon, the assembly comprising: asupport member; an antenna attached to the support member;electromagnetic interference (EMI) shielding structure attached to thesupport member; whereby, when the support member is adjacent the printedcircuit board, and between the front and back housing portions, the EMIshielding structure is operable for providing EMI shielding for one ormore electronic components that are disposed within the interior definedby the EMI shielding structure and the printed circuit board.
 12. Theassembly of claim 11, wherein the support member comprises a middledeck.
 13. The assembly of claim 12, wherein: the antenna is mounted tothe middle deck without any direct physical attachment of the antenna tothe printed circuit board; and the EMI shielding structure is mounted tothe middle deck without any direct physical attachment of the EMIshielding structure to the printed circuit board.
 14. The assembly ofclaim 11, wherein: the support member comprises an internal frame havingan opening configured for receiving therein the EMI shielding structure;and the antenna and EMI shielding structure are attached directly to thesupport member without any direct physical attachment to the printedcircuit board; and the EMI shielding structure and the support memberare configured to form a snap-fit, interference fit, or friction fitconnection therebetween.
 15. The assembly of claim 11, wherein: thesupport member includes generally oppositely facing first and secondsides; the antenna is attached directly to the first side of the supportmember; and the EMI shielding structure is attached directly to thesecond side of the support member.
 16. The assembly of claim 11,wherein: the antenna and EMI shielding structure are attached directlyto the support member with a spaced distance separating the antenna fromthe EMI shielding structure; and the support member is dielectric; andthe antenna comprises a PIFA patch antenna having etched copper filmthat is attached to the support member.
 17. The assembly of claim 11,wherein: the EMI shielding structure comprises at least one resilientfinger extending generally outwardly from the EMI shielding structure,for electrically contacting at least one electrically conductive surfaceof the printed circuit board; and the EMI shielding structure includes alid portion and plurality of walls depending from the lid portion; andthe EMI shielding structure defines two or more EMI shieldingcompartments corresponding to the layout of the electronic components ofthe printed circuit board, such that the electronic components are indifferent EMI shielding compartments; and the EMI shielding structure ismonolithically formed as a single component structure.
 18. The assemblyof claim 11, wherein the EMI shielding structure includes one or morespring fingers configured for contacting one or moreelectrically-conductive surfaces of the printed circuit board.
 19. Theassembly of claim 18, wherein the one or more spring fingers are formedfrom electrically-conductive material having sufficient resiliency forpermitting the one or more spring fingers to be at least partiallydeflected and then to respond with a sufficient restorative force forbiasing the one or more spring fingers against the one or moreelectrically-conductive surfaces of the printed circuit board, formaintaining good electrical contact with the one or moreelectrically-conductive surfaces of the printed circuit board.
 20. Aportable communications terminal including the assembly of claim
 11. 21.A method relating to a portable communications terminal, the methodcomprising attaching electromagnetic interference (EMI) shieldingstructure directly to a support member for a portable communicationsterminal, an antenna for receiving and transmitting signals also beingattached to the support member, whereby the EMI shielding structure isoperable for providing EMI shielding for one or more electroniccomponents of a printed circuit board of the portable communicationsterminal when the support member is adjacent the printed circuit boardand between front and back housing portions of the portablecommunications terminal.
 22. The method of claim 21, further comprisingpositioning the support member relative to the printed circuit boardsuch that the EMI shielding structure provides EMI shielding for one ormore electronic components of the printed circuit board.
 23. The methodof claim 22, wherein: the EMI shielding structure defines two or moreEMI shielding compartments corresponding to the layout of the electroniccomponents of the printed circuit board, and wherein positioningincludes the one or more electronic components being positioned indifferent EMI shielding compartments; and the EMI shielding structureincludes one or more spring fingers, and wherein the positioningincludes contacting the one or more spring fingers with one or moreelectrically-conductive surfaces of the printed circuit board; andpositioning includes compressively sandwiching the EMI shieldingstructure between the support member and the printed circuit board. 24.The method of claim 21, wherein: the EMI shielding structure defines twoor more EMI shielding compartments corresponding to the layout of theelectronic components of the printed circuit board; and attachinginclude forming a snap-fit, interference fit, or friction fit connectionbetween the EMI shielding structure and the support member; and the EMIshielding structure is monolithically formed as a single componentstructure; and the EMI shielding structure includes one or more springfingers; and the method further comprises comprising shipping thesupport member with EMI shielding structure and antenna attached theretoto a customer, without other components of the portable communicationsterminal; and the method further comprises attaching the EMI shieldingstructure on a side of the support member opposite the side to which theantenna is attached.
 25. A method relating to a portable communicationsterminal having front and back housing portions, the method comprisingpositioning a support member between the front and back housing portionsrelative to a printed circuit board of the portable communicationterminal such that electromagnetic interference (EMI) shieldingstructure attached to the support member provides EMI shielding for oneor more electronic components of the printed circuit board, the supportmember also supporting an antenna for receiving and transmitting signalsalso attached to the support member.
 26. The method of claim 25,wherein: the EMI shielding structure defines two or more EMI shieldingcompartments corresponding to the layout of the electronic components ofthe printed circuit board, and wherein positioning includes the one ormore electronic components being positioned in different EMI shieldingcompartments; and the EMI shielding structure includes one or morespring fingers, and wherein the positioning includes contacting the oneor more spring fingers with one or more electrically-conductive surfacesof the printed circuit board; and positioning includes compressivelysandwiching the EMI shielding structure between the support member andthe printed circuit board; and the EMI shielding structure ismonolithically formed as a single component structure; and the methodfurther comprises shipping the support member with EMI shieldingstructure and antenna attached thereto to a customer, without othercomponents of the portable communications terminal; and the EMIshielding structure is attached to a side of the support member oppositethe side to which the antenna is attached.